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Postdoctoral Position in mixed signal ASIC Design and DSP ASIC Design

Overview

The positions are located in Beijing, China. You will get a chance to perform and thrive in a highly competitive and well-funded research environment. The position may lead to a long-term faculty position upon performances. Competitive compensation depended on experiences.

1.  Postdoctoral Position in mixed signal ASIC

Requirements

Highly motivated PhD graduate in the area of IC chip design. Major in EE, Computer Sciences, Precision Instruments, Automation Control, Signal Processing.

Must have a good theoretical foundation and hands-on skills in ASIC chip design. knowledge of IC process techniques and trade-offs. The successful candidate must have solid knowledge of: 1. Analog circuit design and IC design tools, 2. Semiconductor physics, 3. feedback control theory.  Good knowledge of signal processing theory is helpful.

Responsibilities

The job includes design and development of low noise analog and mixed signal circuit, IC circuit layout, verification and testing; develop MEMS sensor weak signal read-out IC circuit.  It also involves with system design and simulation, device characterization of silicon-based microdevices for industry application.

The candidate will be responsible but not limited to:

-Interfacing with IC foundry and follow the design rules, tape-out, test board design and device evaluation.

- Documenting and reporting results on a regular basis

2.  Postdoctoral Position in DSP ASIC Design                

Requirements

Highly motivated PhD graduate in the area of IC chip design. Major in EE, Computer Sciences, Precision Instruments, Automation Control, Signal Processing.

Must have a good theoretical foundation and hands-on skills in digital ASIC chip design and FPGA. knowledge of IC process techniques and trade-offs. The successful candidate must have solid knowledge of: 1. digital IC design, 2. IC design tools, 3. Digital filter design and FPGA implementation. Good knowledge of signal processing theory is helpful.

Responsibilities

The job requires design and development of digital IC circuit and testing.  It involves with SOC ASIC design, simulation, FPGA verification, layout, tape-out, firmware development, and device characterization of silicon-based microdevices for industry application.

The candidate will be responsible but not limited to:

- Digital IC circuit design and implementation, testing and device evaluation.

- Documenting and reporting results on a regular basis

Application

send your CV to xbqiu@mail.buct.edu.cn before March 31, 2017

 

About BAIC-SM, BUCT 

http://en.baicsm.buct.edu.cn/index.htm

Beijing Advanced Innovation Center for Soft Matter Science and Engineering (BAIC-SM) was built on our existing strengths of research and started operations in 2014 as “BUCT International Research Center for Soft Matter”. At that time, Daan Frenkel (Professor, University of Cambridge) served as the Center Director, Gan, Zhihua (Professor, Beijing University of Chemical Technology) severed as Associate Director, Pablo Gaston Debenedetti (Professor, Dean for Research at Princeton University) served as Chair of the Academic Committee , Tan, Tianwei (Professor, Beijing University of Chemical Technology) as Chair of the Administrative Committee and Wang, Wenchuan (Professor, Beijing University of Chemical Technology) as Associate Chair of the Academic Committee. In addition, we have 5 faculty members initially, including 4 Part-time principal investigators: Frantisek Svec (Staff Scientist and Facility Director of E.O. Lawrence Berkeley National Laboratory), Lee Cronin (Professor, University of Glasgow), Hui-min Li (Professor, National Chemical Engineering Institute in Paris), and Duli Yu (Professor, Beijing University of Chemical Technology); One full-time principal investigator, Dr. Jure Dobnikar.

 In September 2015, BAIC-SM officially launched with research grant from the Beijing Municipal Government and the grant support will continue for 5-10 consecutive years. The center now has expanded to include three research divisions: Soft Matter Science Division, Soft Matter in Life Sciences and Technology Division and Soft Matter in Functional Materials Science and Engineering Division.